![]() The first three wafers exhibited consistent edge chipping, wafer to wafer, however, the blade wear was highly unstable. It was in the initial cuts of the fourth consecutive wafer that edge chipping increased from less than 0.002 in (0.051mm) to 0.008 in (0.203mm) in size. ![]() ![]() We knew that all selected feed rates could not possibly be optimum and therefore proceeded as follows:Ī feed rate of 0.100in/s (2.54mm/s) was selected and each cut was observed until the first indication of excessive chipping could be noted. With respect to the stated objectives, given feed rate, edge chipping developed beyond specification, and after subsequent cuts the diamond blade broke. ![]() Reprinted from “The Resin-Bonded Diamond Blade for Dicing Hard, & Brittle Materials.” February, 1981Īt various feed rates, an entire wafer could be diced with no indication of impending failure. By John Boucher, President, Thermocarbon, Inc., Casselberry, Florida ![]()
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